Patent · US Active

Method and apparatus for preparing fold lines

US8894808B2 · kind B2 · utility

2Cited by

6References

11Claims

0Family size

Assignee

SIG Technology AG · CH

Inventors

Werner Seiche · Bergheim, DE
Toma Schneider · Dresden, DE
Jorg Berger · Lich, DE

Key dates

Filing date	Sep 18, 2009
Grant date	Nov 25, 2014
Priority date	—
Expiry date	Mar 27, 2031

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T156/1153
WIPO fieldTextile and paper machines
WIPO sectorMechanical engineering

Abstract

The method and the apparatus are used for preparing fold lines on laminated materials on the basis of cardboard. At least one region intended for providing the fold line is subjected to heat such that an at least partial local reduction of shear fracture stresses of the material is produced in said region. The application of heat is done using a heating device, which is disposed adjacent to a guide device for the laminate. The local reduction of the shear fracture stresses supports local delamination, which supports the formation of a folding joint.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.