Polyamide resin composition and molded product
US8895122B2 · kind B2 · utility
0Cited by
4References
22Claims
0Family size
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Inventors
Key dates
| Filing date | Jun 9, 2010 |
| Grant date | Nov 25, 2014 |
| Priority date | — |
| Expiry date | Nov 23, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/139
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Disclosed is an m-xylene group-containing polyamide resin composition having excellent gas barrier properties and heat aging resistance, which contains (A) a polyamide composed of a diamine unit containing 30% by mole or more of an m-xylylenediamine unit and a dicarboxylic acid unit and (B) an aromatic secondary amine based compound and has an oxygen permeability coefficient of not more than 1 cc·mm/m2·day·atm at 23° C. and 75% RH.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.