Methods for bonding material layers to one another and resultant apparatus
US8895362B2 · kind B2 · utility
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3References
20Claims
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Key dates
| Filing date | Feb 25, 2013 |
| Grant date | Nov 25, 2014 |
| Priority date | — |
| Expiry date | Feb 25, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
Methods and apparatus provide for a structure, including: a first glass material layer; and a second material layer bonded to the first glass material layer via bonding material, where the bonding material is formed from one of glass frit material, ceramic frit material, glass ceramic frit material, and metal paste, which has been melted and cured.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.