Release strategies for making transferable semiconductor structures, devices and device components

US8895406B2 · kind B2 · utility

Assignee

• The Board of Trustees of the University of Illinois · US

Inventors

• John A. Rogers · Champaign, US
• Ralph G. Nuzzo · Champaign, US
• Matthew Meitl · Durham, US
• Heung Cho Ko · Gwangju, KR
• Jongseung Yoon · Urbana, US
• Etienne Menard · Châteauroux, FR
• Alfred J. Baca · Ridgecrest, US

Key dates

• Filing date: Mar 24, 2011
• Grant date: Nov 25, 2014
• Expiry date: Jun 13, 2031

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T156/1195
• WIPO field: Micro-structural and nano-technology
• WIPO sector: Chemistry

Abstract

Provided are methods for making a device or device component by providing a multilayer structure having a plurality of functional layers and a plurality of release layers and releasing the functional layers from the multilayer structure by separating one or more of the release layers to generate a plurality of transferable structures. The transferable structures are printed onto a device substrate or device component supported by a device substrate. The methods and systems provide means for making high-quality and low-cost photovoltaic devices, transferable semiconductor structures, (opto-)electronic devices and device components.