Composition for printing a seed layer and process for producing conductor tracks

US8895651B2 · kind B2 · utility

Assignee

• BASF SE

Inventors

• Stephan Hermes · Bad Dürkheim, DE
• Sorin Ivanovici · Ludwigshafen, DE

Key dates

• Filing date: Feb 15, 2011
• Grant date: Nov 25, 2014
• Expiry date: May 18, 2032

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/76873
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

The invention relates to a composition for printing a seed layer for electrodeposition or electroless deposition of a metal for the production of full-area or structured metallic surfaces on a substrate, comprising 0.1 to 6% by weight of electrolessly and/or electrolytically coatable particles, 40 to 98.8% by weight of at least one solvent, 0 to 15% by weight of a crosslinker, 0.1 to 6% by weight of at least one dispersing additive, 0 to 5% by weight of at least one further additive and 1 to 20% by weight of at least one polymer, said at least one polymer being in the form of a dispersion. The invention further relates to a process for producing full-area or structured metallic surfaces on a substrate, and to a use of the process.