Multilayer printed circuit board
US8895863B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 26, 2012 |
| Grant date | Nov 25, 2014 |
| Priority date | — |
| Expiry date | May 28, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10969
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A multilayer printed circuit board includes an insulating substrate, circuit layers arranged in the insulating substrate, an electronic component, an electrode disposed on the circuit layer exposed from a surface of the insulating substrate and including a soldered portion at which a terminal of the electronic component is soldered, an internal layer conductor disposed on the circuit layer located inside the insulating substrate and defining through holes in a radial manner centering on the soldered portion, a heat releasing conductor disposed on the circuit layer next to the circuit layer on which the internal layer conductor is disposed, and connection vias inserted in the through holes and coupling the electrode and the heat releasing conductor so as to enable a heat transfer between the electrode and the heat releasing conductor. The internal layer conductor and the heat releasing conductor overlap a whole area of the soldered portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.