Conductive connections allowing XYZ translation
US8895865B2 · kind B2 · utility
43Cited by
29References
20Claims
0Family size
Inventors
Key dates
| Filing date | Sep 7, 2012 |
| Grant date | Nov 25, 2014 |
| Priority date | — |
| Expiry date | Dec 23, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49126
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The embodiments relates generally to the use of conductive connections for electrically grounding a series of conductive substrates. More specifically the embodiments teach configurations of conductive connections that do not overly constrain relative motion between the connected conductive substrates. Conductive pressure sensitive adhesive is used to attach opposing ends of the conductive connectors to the conductive substrates. A substrate portion of the conductive connectors is scored by a cutting device such as a die cutter to reduce rigidity of the substrate portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.