Printed circuit board and method of manufacturing the same
US8895870B2 · kind B2 · utility
1Cited by
6References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 24, 2010 |
| Grant date | Nov 25, 2014 |
| Priority date | — |
| Expiry date | Jul 14, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09727
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A plurality of wiring traces and a plurality of lead wires for plating are formed on a base insulating layer. Each wiring trace and each lead wire for plating are integrally formed with each other. An electrode pad is provided at an end of each wiring trace, and the lead wire for plating is provided to extend from each electrode pad toward the opposite side to the wiring trace. A width of each lead wire for plating is set larger than a width of each wiring trace.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.