Camera module having a light shieldable layer
US8896079B2 · kind B2 · utility
4Cited by
14References
11Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 20, 2013 |
| Grant date | Nov 25, 2014 |
| Priority date | — |
| Expiry date | Dec 20, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/00014
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A camera module has a sensor chip including a sensor unit formed on a main surface around which sides are disposed. A lens chip is fixed to the sensor chip with a spacer unit and includes a lens unit corresponding to the sensor unit. A light shieldable layer covers a first side of the sensor chip and a side of the spacer unit. A first cutting surface includes a second side of the sensor chip and a side of the light shieldable layer on a same plane.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.