Methods and apparatus for inductors and transformers in packages
US8896094B2 · kind B2 · utility
25Cited by
4References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 23, 2013 |
| Grant date | Nov 25, 2014 |
| Priority date | — |
| Expiry date | Jan 23, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19042
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods and apparatus for forming a semiconductor device package with inductors and transformers using a micro-bump layer are disclosed. The micro-bump layer may comprise micro-bumps and micro-bump lines, formed between a top die and a bottom die, or between a die and an interposer. An inductor can be formed by a redistribution layer within a bottom device and a micro-bump line above the bottom device connected to the RDL. The inductor may be a symmetric inductor, a spiral inductor, a helical inductor which is a vertical structure, or a meander inductor. A pair of inductors with micro-bump lines can form a transformer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.