Patent · US Active

Paste thermal interface materials

US8896110B2 · kind B2 · utility

28Cited by

7References

27Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Wei Hu · Beijing, CN
Zhizhong Tang · Palo Alto, US
Syadwad Jain · Chandler, US
Rajen S. Sidhu · Chandler, US

Key dates

Filing date	Mar 13, 2013
Grant date	Nov 25, 2014
Priority date	—
Expiry date	Mar 13, 2033

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/16251
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Embodiments of the present disclosure describe techniques and configurations for paste thermal interface materials (TIMs) and their use in integrated circuit (IC) packages. In some embodiments, an IC package includes an IC component, a heat spreader, and a paste TIM disposed between the die and the heat spreader. The paste TIM may include particles of a metal material distributed through a matrix material, and may have a bond line thickness, after curing, of between approximately 20 microns and approximately 100 microns. Other embodiments may be described and/or claimed.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.