Thin film magnetic head with side layers under compression stress
US8896974B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 29, 2013 |
| Grant date | Nov 25, 2014 |
| Priority date | — |
| Expiry date | Mar 29, 2033 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11B2005/3996
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A thin film magnetic head includes a spin valve film that includes a magnetization free layer, a magnetization pinned layer and a non-magnetic spacer layer that is disposed between the magnetization free and pinned layers, and a pair of side layers that are disposed at both sides of the spin valve film in a track width direction and at least in the vicinity of the magnetization free layer and the magnetization pinned layer. Each of the side layers has a bias magnetic field application layer that includes a soft magnetic layer and applies a bias magnetic field in the track width direction to the magnetization free layer, and a gap layer that is positioned between the spin valve film and the bias magnetic field application layer, and the side layers have compression stresses at least in the vicinity of the magnetization pinned layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.