High performance liquid cooled heatsink for IGBT modules
US8897010B2 · kind B2 · utility
3Cited by
10References
19Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 22, 2011 |
| Grant date | Nov 25, 2014 |
| Priority date | — |
| Expiry date | Jan 19, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20936
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A heat sink assembly includes a base plate coupled to a first side of an electronic device. A plurality of fins extend from the base plate and are positioned within a housing. The housing includes a first manifold defining a plurality of first passages and a second manifold defining a plurality of second passages in fluid communication with the plurality of first passages. At least one of the plurality of first passages extends between an adjacent pair of the plurality of second passages and is oriented to channel fluid toward at least one of the plurality of fins.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.