Heat dissipation system for power module
US8897011B2 · kind B2 · utility
3Cited by
9References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 17, 2012 |
| Grant date | Nov 25, 2014 |
| Priority date | — |
| Expiry date | May 23, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed herein is a heat dissipation system for a power module, the heat dissipation system including: first and second heat dissipation plates spaced apart from each other while facing each other, to form a cooling medium flow passage; first and second inflow lines extended to the cooling medium flow passage of the first and second heat dissipation plates, to transfer cooling media flowing therein at different flow rates or different fluxes to the cooling medium flow passage; and first and second inlets respectively connected with the first and second inflow lines to allow the cooling media to flow therein.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.