Method for producing multilayer substrate and desmearing method
US8898895B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 16, 2013 |
| Grant date | Dec 2, 2014 |
| Priority date | — |
| Expiry date | Aug 16, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for producing a multilayer substrate involves: a base-material pretreatment step in which a hole forming step and a metal adhesion step are performed in no particular order, the hole forming step being a step of subjecting a core base material having at least an insulating layer and a first metal layer to a hole opening process, the metal adhesion step being a step in which a predetermined metal or metal ion is made to adhere to the other surface of the insulating layer; a desmearing step of performing desmearing by plasma etching; a cleaning step of cleaning the core base material by using an acidic solution; and a plating step of applying a plating catalyst or a precursor thereof onto the insulating layer and performing plating.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.