Interface design of TSP shear cutters
US8899358B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 27, 2011 |
| Grant date | Dec 2, 2014 |
| Priority date | — |
| Expiry date | Mar 7, 2033 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC04B2237/76
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A method of forming a cutting element is disclosed, wherein the method includes forming a substrate body, forming an intermediate layer on the substrate body, forming a diamond table, and positioning the diamond table on the intermediate layer, such that the intermediate layer is disposed between the substrate body and the diamond table. The intermediate layer has a base portion having a base height and a ring portion having a ring height HR, wherein the intermediate layer has a height HT equal to the sum of the base height and ring height. The diamond table has a cutting layer having a cutting layer diameter D1 and a cutting layer height HE and a protrusion having a protrusion diameter D2 and a protrusion height HP.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.