Texturing and cleaning agent for the surface treatment of wafers and use thereof

US8900472B2 · kind B2 · utility

Assignee

• Fraunhofer-Gesellschaft zur förderung der angewandten Forschung e.V. · DE

Inventors

• Kuno Mayer · Frankfurt am Main, DE
• Mark Schumann · Glückstadt, DE
• Daniel Kray · Glückstadt, DE
• Teresa Orellana Peres · Glückstadt, DE
• Jochen Rentsch · Emmendingen, DE
• Martin Zimmer · Rheinau, DE
• Elias Kirchgässner · Glückstadt, DE
• Eva Zimmer · Glückstadt, DE
• Daniel Biro · Glückstadt, DE
• Arpad Mihai Rostas · Glückstadt, DE
• Filip Granek · Wrocław, PL

Key dates

• Filing date: Jun 2, 2010
• Grant date: Dec 2, 2014
• Expiry date: Jul 8, 2031

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C11D2111/22
• WIPO field: Basic materials chemistry
• WIPO sector: Chemistry

Abstract

A liquid agent for the surface treatment of monocrystalline wafers, which contains an alkaline etching agent and also at least one low-volatile organic compound. Systems of this type can be used both for the cleaning, damage etch and texturing of wafer surfaces in a single etching step and exclusively for the texturing of silicon wafers with different surface quality, whether it now be wire-sawn wafers with high surface damage or chemically polished surfaces with minimum damage density.