Stable nanoparticles for electroless plating
US8900666B2 · kind B2 · utility
1Cited by
1References
4Claims
0Family size
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Key dates
| Filing date | Oct 21, 2011 |
| Grant date | Dec 2, 2014 |
| Priority date | — |
| Expiry date | Jul 11, 2033 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C18/28
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Stable tin-free palladium catalysts are used to metalize through-holes of printed circuit boards. A stabilizer is included in the catalyst formulation which prevents precipitation and agglomeration of the palladium.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.