Light-emitting device, method for manufacturing same, and molded part
US8900710B2 · kind B2 · utility
0Cited by
4References
16Claims
0Family size
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Key dates
| Filing date | Feb 5, 2008 |
| Grant date | Dec 2, 2014 |
| Priority date | — |
| Expiry date | Jan 19, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31511
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A light-emitting device includes a light-emitting element on a molded part. The molded part is formed by molding and curing a thermosetting epoxy resin composition comprising (A) the reaction product of a triazine derived epoxy resin with an acid anhydride, (B) an internal parting agent having m.p. 50-90° C., (C) a reflective agent, (D) an inorganic filler, and (E) a curing catalyst.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.