Patent · US Active

Method of producing a radiation-emitting optoelectronic component

US8900894B2 · kind B2 · utility

2Cited by

8References

13Claims

0Family size

Assignee

OSRAM Opto Semiconductors GmbH · DE

Inventors

Ewald Guenther · Regenstauf, DE
Jörg Erich Sorg · Regensburg, DE
Norbert Stath · Regensburg, DE

Key dates

Filing date	Aug 28, 2012
Grant date	Dec 2, 2014
Priority date	—
Expiry date	Aug 28, 2032

Classification

Technology area (CPC H)Electricity
CPC primaryH10H20/8516
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

In a method for producing a radiation-emitting optoelectronic component, a semiconductor chip is mounted by a first main area onto a carrier body and is electrically conductively connected at a first contact area to a first connection region, and a transparent electrically insulating encapsulation layer is applied to the chip and the carrier body. A first cutout in the encapsulation layer for at least partly uncovering a second contact area of the chip is produced, and a second cutout in the encapsulation layer for at least partly uncovering a second connection region of the carrier body is produced. Finally, an electrically conductive layer, which electrically conductively connects the second contact area of the semiconductor chip and the second connection region of the carrier body, is applied.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.