Method for manufacturing a semiconductor device using a flexible substrate
US8900970B2 · kind B2 · utility
23Cited by
32References
38Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 13, 2007 |
| Grant date | Dec 2, 2014 |
| Priority date | — |
| Expiry date | May 15, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A technique for peeling an element manufactured through a process at relatively low temperature (lower than 500° C.) from a substrate and transferring the element to a flexible substrate (typically, a plastic film). With the use of an existing manufacturing device for a large glass substrate, a molybdenum film (Mo film) is formed over a glass substrate, an oxide film is formed over the molybdenum film, and an element is formed over the oxide film through a process at relatively low temperature (lower than 500° C.). Then, the element is peeled from the glass substrate and transferred to a flexible substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.