Techniques for processing a substrate

US8900982B2 · kind B2 · utility

Assignee

• Varian Semiconductor Equipment Associates, Inc. · US

Inventors

• Kevin M. Daniels · Lynnfield, US
• Russell L. Low · Rowley, US
• Nicholas P. T. Bateman · Reading, US
• Benjamin B. Riordon · Newburyport, US

Key dates

• Filing date: Apr 7, 2010
• Grant date: Dec 2, 2014
• Expiry date: May 21, 2032

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01J2237/31711
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

Herein, an improved technique for processing a substrate is disclosed. In one particular exemplary embodiment, the technique may be achieved using a mask for processing the substrate. The mask may be incorporated into a substrate processing system such as, for example, an ion implantation system. The mask may comprise one or more first apertures disposed in a first row; and one or more second apertures disposed in a second row, each row extending along a width direction of the mask, wherein the one or more first apertures and the one or more second apertures are non-uniform.