Process for electroless deposition of gold and gold alloys on silicon

US8900998B2 · kind B2 · utility

Assignee

• UNIVERSITY OF WINDSOR · CA

Inventors

• Mordechay Schlesinger · Pittsburgh, US
• Robert Andrew Petro · Windsor, CA

Key dates

• Filing date: Nov 19, 2013
• Grant date: Dec 2, 2014
• Expiry date: Nov 19, 2033

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/02521
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

A plating bath for electroless deposition of gold and gold alloy layers on such silicon-based substrates, includes Na(AuCl4) and/or other gold (III) chloride salts as a gold ion source. The bath is formed as a binary bath solution formed from mixing first and second bath components. The first bath component includes gold salts in concentrations up to 40 g/L, boric acid, in amounts of up to 30 g/L, and a metal hydroxide in amounts up to 20 g/L. The second bath component includes an acid salt, in amounts up to 25 g/L, sodium thiosulfate in amounts up to 30 g/L, and suitable acid, such as boric acid in amounts up to 20 g/L.