Aqueous acidic solution and etching solution and method for texturizing the surface of single crystal and polycrystal silicon substrates

US8901000B2 · kind B2 · utility

Assignee

• BASF SE

Inventors

• Simon Braun · Mannheim, DE
• Andreas Klipp · Lambsheim, DE
• Cornelia Roeger-Goepfert · Weinheim, DE
• Christian Bittner · Bensheim, DE
• MeiChin Shen · Taoyuan, TW
• Chengwei Lin · Nanhu, CN

Key dates

• Filing date: Aug 25, 2011
• Grant date: Dec 2, 2014
• Expiry date: Aug 25, 2031

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T428/24355
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

An aqueous acidic solution and an aqueous acidic etching solution suitable for texturizing the surface of single crystal and polycrystal silicon substrates, hydrofluoric acid; nitric acid; and at least one anionic polyether, which is surface active; a method for texturizing the surface of single crystal and polycrystal silicon substrates comprising the step of (1) contacting at least one major surface of a substrate with the said aqueous acidic etching solution; (2) etching the at least one major surface of the substrate for a time and at a temperature sufficient to obtain a surface texturization consisting of recesses and protrusions; and (3) removing the at least one major surface of the substrate from the contact with the aqueous acidic etching solution; and a method for manufacturing photovoltaic cells and solar cells using the said solution and the said texturizing method.