Adhesive composition, film adhesive, and heat treatment method
US8901235B2 · kind B2 · utility
0Cited by
13References
11Claims
0Family size
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Key dates
| Filing date | Dec 6, 2010 |
| Grant date | Dec 2, 2014 |
| Priority date | — |
| Expiry date | Dec 6, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2896
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
An adhesive composition of the present invention contains, as a main composition, a polymer obtained by copolymerizing a monomer composition containing a monomer having a maleimide group, and further contains a thermal polymerization inhibitor. As a result, it is possible to provide an adhesive composition that allows forming an adhesive layer that is excellently dissolved after the adhesive layer has been subjected to a high-temperature process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.