Mitigation of block bending in a ring laser gyroscope caused by thermal expansion or compression of a circuit board
US8901432B2 · kind B2 · utility
0Cited by
34References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 30, 2011 |
| Grant date | Dec 2, 2014 |
| Priority date | — |
| Expiry date | Aug 25, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49124
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An apparatus includes a sheet of circuit board material, at least one electrically conductive trace positioned on the sheet of circuit board material, and at least one electrically conductive contact pad positioned on the sheet of circuit board material and coupled to the at least one electrically conductive trace. The apparatus further includes at least one deformation point configured to absorb stresses developed in the sheet of circuit board material when the sheet of circuit board material experiences resistance to expansion or compression caused by connection to an object resisting expansion or compression.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.