Board unit and method of fabricating the same
US8901434B2 · kind B2 · utility
0Cited by
9References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 16, 2012 |
| Grant date | Dec 2, 2014 |
| Priority date | — |
| Expiry date | Aug 13, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49153
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A board unit includes a board that has a through hole penetrating the board from a first side of the board to a second side of the board and having a conductive inner wall surface a first electronic component that has a first connection pin to be press-fitted in the through hole from the first side of the board, and a conductive member that is disposed in the through hole to connect the inner wall surface of the through hole to the first connection pin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.