Cutting device for transdermal and orally dissolvable films
US8901456B2 · kind B2 · utility
0Cited by
2References
3Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 29, 2011 |
| Grant date | Dec 2, 2014 |
| Priority date | — |
| Expiry date | Nov 11, 2032 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2103/42
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The invention relates to methods and an apparatus for cutting planar substrates charged with pharmaceutically active agents. In particular, the planar substrates comprise transdermal systems or orally dissolvable films.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.