Patent · US Active

Thin-film heterostructure thermoelectrics in a group IIa and IV-VI materials system

US8901612B2 · kind B2 · utility

6Cited by
3References
17Claims
0Family size

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Key dates

Filing dateFeb 24, 2012
Grant dateDec 2, 2014
Priority date
Expiry dateApr 5, 2032

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH10D62/80

Abstract

Embodiments of a thin-film heterostructure thermoelectric material and methods of fabrication thereof are disclosed. In general, the thermoelectric material is formed in a Group IIa and IV-VI materials system. The thermoelectric material includes an epitaxial heterostructure and exhibits high heat pumping and figure-of-merit performance in terms of Seebeck coefficient, electrical conductivity, and thermal conductivity over broad temperature ranges through appropriate engineering and judicious optimization of the epitaxial heterostructure.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.