Micro electro mechanical system (MEMS) microphone and fabrication method thereof
US8901683B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jul 3, 2013 |
| Grant date | Dec 2, 2014 |
| Priority date | — |
| Expiry date | Jul 3, 2033 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81B2201/0257
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
Provided is a structure for improving performance of a micro electro mechanical system (MEMS) microphone by preventing deformation from occurring due to a residual stress and a package stress of a membrane and by decreasing membrane rigidity. A MEMS microphone according to the present disclosure includes a backplate formed on a substrate; an insulating layer formed on the substrate to surround the backplate; a membrane formed to be separate from above the backplate by a predetermined interval; a membrane supporting portion configured to connect the membrane to the substrate; and a buffering portion formed in a double spring structure between the membrane and the membrane supporting portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.