Integrated circuit having a semiconducting via; an integrated circuit including a sensor, such as a photosensitive device, and a method of making said integrated circuit

US8901697B2 · kind B2 · utility

Assignee

• Analog Devices, Inc. · US

Inventor

• Bernard Patrick Stenson · Limerick, IE

Key dates

• Filing date: Mar 16, 2012
• Grant date: Dec 2, 2014
• Expiry date: Jun 17, 2032

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y02E10/548

Abstract

An integrated circuit having an insulated conductor or within a semiconductor substrate and extending perpendicular to a plane of a semiconductor wafer or substrate on which the integrated circuit is fabricated, the conductor comprising a first region of doped semiconductor extending between a first device or a first contact and a second device or a second contact.