Transmission line formed adjacent seal ring
US8901714B2 · kind B2 · utility
3Cited by
14References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 13, 2013 |
| Grant date | Dec 2, 2014 |
| Priority date | — |
| Expiry date | Jun 13, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit device includes a semiconductor body, active components formed over the semiconductor body, one or more seal rings surrounding the active components, and a signal line. One or more of the seal rings are configured to provide the primary return path for current flowing through the signal line.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.