Heat pipes and thermoelectric cooling devices
US8904808B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 15, 2010 |
| Grant date | Dec 9, 2014 |
| Priority date | — |
| Expiry date | Nov 28, 2030 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF25B2321/025
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
In various embodiments of the present invention, a thermoelectric cooling device with a thermoelectric device, heat pipe and a heat sink is provided. The thermoelectric device is connected to a chamber through a metal standoff. The chamber contains a fluid that needs to be cooled. The metal standoff has a shape, e.g. a bevel shape, to minimize heat leakage into the fluid. The heat pipes are preferably connected to the thermoelectric device with a Thermal Interface Material (TIM). In one embodiment, the heat pipes are attached to the thermoelectric device through screws which have an insulating standoff so as to minimize heat leakage into the fluid. In another embodiment of the present invention, two stage thermoelectric cooling devices with multiple heat pipes and common heat sink are provided to cool the fluid.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.