Plasma stamp, plasma treatment device, method for plasma treatment and method for producing a plasma stamp
US8904956B2 · kind B2 · utility
0Cited by
4References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 20, 2009 |
| Grant date | Dec 9, 2014 |
| Priority date | — |
| Expiry date | Jul 15, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T137/8593
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The invention relates to a plasma stamp, with which surfaces can be subjected to a plasma treatment. In addition, the invention relates to a plasma treatment device, with which surfaces can be subjected to a plasma treatment, and also a plasma treatment method. In addition, the invention relates to a method for producing a plasma stamp.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.