Apparatus for mounting semiconductor chips on a circuit board
US8905290B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 25, 2013 |
| Grant date | Dec 9, 2014 |
| Priority date | — |
| Expiry date | Nov 25, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A chip mounting apparatus includes a loading unit, a combining unit and a bonding unit. The loading unit loads a circuit board having contact pads and semiconductor chips having solder balls into the chip mounting apparatus. The combining unit positions the semiconductor chip onto a respective mounting area of the circuit board and combines the solder balls of the semiconductor chip with the contact pads of the circuit board by using flux. The combining unit has a flux coater for coating the solder balls with the flux and a flux controller for automatically supplementing the flux to the flux coater. The bonding unit bonds the solder balls to the respective contact pads by a reflow process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.