Temperature sensor attachment facilitating thermal conductivity to a measurement point and insulation from a surrounding environment
US8905635B2 · kind B2 · utility
5Cited by
41References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 30, 2011 |
| Grant date | Dec 9, 2014 |
| Priority date | — |
| Expiry date | Aug 18, 2032 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01K1/16
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A temperature sensor package includes a temperature sensor having a first side and a second side, wherein the first side of the temperature sensor includes an active region configured for coupling with a target area for temperature measurement of an object. The temperature sensor package further includes a circuit board having a first side and a second side, the first side of the circuit board coupled to the second side of the temperature sensor, wherein the circuit board provides thermal insulation between the active region of the temperature sensor and an environment on the second side of the circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.