Patent · US Active

Component and method for assembling an implant arrangement

US8906091B2 · kind B2 · utility

5Cited by

2References

20Claims

0Family size

Assignee

DePuy Synthes Products, Inc. · US

Inventors

Georg Duda · Berlin, DE
Markus Heller · Herzogenrath, DE

Key dates

Filing date	Nov 28, 2012
Grant date	Dec 9, 2014
Priority date	—
Expiry date	Dec 1, 2032

Classification

Technology area (CPC A)Human Necessities
CPC primaryA61B2090/064
WIPO fieldMedical technology
WIPO sectorInstruments

Abstract

A component for an arrangement at an implant includes a sensor detecting a measurement variable and generating measuring data corresponding to the detected measurement variable; telemetry device transmitting data; a data transmission connection between the sensor and the telemetry device for the transmission of the measuring data therebetween; and an assembly arrangement detachably mounting the component in an implant recess of the implant wherein the component is configured to be insertable through an implant recess of an implant positioned over a target portion of a bone so that the component extends through the opening toward an outer periphery of the target portion of the bone.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.