Method for controlling glue flow
US8906177B2 · kind B2 · utility
0Cited by
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18Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 19, 2011 |
| Grant date | Dec 9, 2014 |
| Priority date | — |
| Expiry date | Apr 29, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for controlling a contact angle between a glue and a surface of a substrate during manufacture of microchip packages is disclosed. The method includes applying a glue to a surface of a substrate, and placing an electrode in electrical connection with the glue. A potential difference is applied between the electrode and the substrate. The potential difference is applied across the glue and causes a contact angle between the glue and the surface of the substrate to be altered.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.