Heat-resistant liquid crystalline polymer composition having a low melting temperature
US8906258B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 27, 2012 |
| Grant date | Dec 9, 2014 |
| Priority date | — |
| Expiry date | Dec 13, 2032 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09K2019/0481
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A thermotropic liquid crystalline polymer composition capable of exhibiting both a low melting temperature and good heat resistance without the use of conventional naphthenic acids is provided. The melting temperature may, for example, range from about 250° C. to about 400° C. Even at such low melting temperatures, the present inventors have surprisingly discovered that the ratio of the deflection temperature under load (“DTUL”), a measure of short term heat resistance, to the melting temperature may remain relatively high. The specific DTUL values may range from about 200° C. to about 300° C. The ability to form a polymer composition with the properties noted above may be achieved, at least in part, by the use of an aromatic amide oligomer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.