Patent · US Active

Method of encapsulation of a microcomponent

US8906750B2 · kind B2 · utility

0Cited by

1References

18Claims

0Family size

Assignee

COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES · FR

Inventors

Fabrice Jacquet · Le Pont-de-Claix, FR
David Henry · Platte City, US

Key dates

Filing date	Jan 2, 2012
Grant date	Dec 9, 2014
Priority date	—
Expiry date	Jan 4, 2032

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/12042
WIPO fieldMicro-structural and nano-technology
WIPO sectorChemistry

Abstract

A method for encapsulating a microcomponent positioned on a substrate, including: a) production of an electrical contact pad on the substrate; b) production of a portion of sacrificial material covering the microcomponent and the electrical contact pad; c) production of an encapsulation layer covering the sacrificial material and a first face of the substrate; d) production, through the substrate, of a hole aligned with the electrical contact pad and emerging at the portion of sacrificial material; e) elimination of the portion of sacrificial material through the hole; f) production, in the hole, of a conductive portion electrically connected to the electrical contact pad, forming a conductive via.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.