Curable composition
US8907024B2 · kind B2 · utility
2Cited by
4References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 18, 2011 |
| Grant date | Dec 9, 2014 |
| Priority date | — |
| Expiry date | Nov 18, 2031 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J183/16
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An object of the present invention is to provide a curable composition that provides high hardness and can be used in adhesives and coating agents. This object can be achieved by a curable composition containing: 100 parts by weight of a reactive silyl group-containing organic polymer (A) that has a number average molecular weight of 2,000 to 6,000 and contains 1.3 to 5 reactive silyl groups per molecule; and 0 to 40 parts by weight of a plasticizer (C). This curable composition is suitable for flooring adhesives and tile adhesives, which require high hardness.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.