Multiple surface integrated devices on low resistivity substrates
US8907227B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 2, 2012 |
| Grant date | Dec 9, 2014 |
| Priority date | — |
| Expiry date | Oct 26, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention relates to a device with portions of the device on plural substrate surfaces. The device includes a low resistivity substrate having first and second surfaces with a first electrically-conductive device component disposed over a first surface. An intermediate electrically-insulating layer may be disposed between the electrically-conductive component and the low resistivity substrate. A second electrically-conductive component is disposed over the second surface of the low resistivity substrate. A cavity formed in the low resistivity substrate is at least partially filled with a high resistivity material. One or more electrically-conducting pathways are formed in the high resistivity material electrically connecting the first electrically conductive component and the second electrically-conductive component to form a device. Exemplary devices include inductors, capacitors, antennas and active or passive devices incorporating such devices. Vertically integrated device systems can be formed using the device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.