Electronic devices with yielding substrates
US8907370B2 · kind B2 · utility
11Cited by
84References
34Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 31, 2014 |
| Grant date | Dec 9, 2014 |
| Priority date | — |
| Expiry date | Jan 31, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
In accordance with certain embodiments, a semiconductor die is adhered directly to a yielding substrate with a pressure-activated adhesive notwithstanding any nonplanarity of the surface of the semiconductor die or non-coplanarity of the semiconductor die contacts.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.