Focal plane array with modular pixel array components for scalability

US8907439B1 · kind B1 · utility

Assignee

• Sandia Corporation · US

Inventors

• Randolph R. Kay · Albuquerque, US
• David V. Campbell · Tijeras, US
• Subhash L. Shinde · Croton-on-Hudson, US
• Jeffrey L. Rienstra · Albuquerque, US
• Darwin K. Serkland · Albuquerque, US
• Michael Lowell Holmes · Lebanon, US
• Seethambal S. Mani · Albuquerque, US
• Joy M. Barker · Albuquerque, US
• Dahwey Chu · Albuquerque, US
• Thomas M. Gurrieri · Albuquerque, US

Key dates

• Filing date: Jun 20, 2011
• Grant date: Dec 9, 2014
• Expiry date: Sep 15, 2033

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10F39/809

Abstract

A modular, scalable focal plane array is provided as an array of integrated circuit dice, wherein each die includes a given amount of modular pixel array circuitry. The array of dice effectively multiplies the amount of modular pixel array circuitry to produce a larger pixel array without increasing die size. Desired pixel pitch across the enlarged pixel array is preserved by forming die stacks with each pixel array circuitry die stacked on a separate die that contains the corresponding signal processing circuitry. Techniques for die stack interconnections and die stack placement are implemented to ensure that the desired pixel pitch is preserved across the enlarged pixel array.