Wafer-level RF transmission and radiation devices
US8907849B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 12, 2012 |
| Grant date | Dec 9, 2014 |
| Priority date | — |
| Expiry date | Apr 27, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01Q21/0081
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
Method for constructing a dipole radio frequency antenna includes depositing on a dielectric substrate at least one layer each of a conductive material, a dielectric material, and a sacrificial material. The deposit of conductive material is controlled to form a transmission line, antenna radiating element and associated antenna feed. The transmission line includes a shield formed of one or more walls and a center conductor disposed coaxially within the shield. An antenna feed portion is electrically connected to the center conductor and extends through a feed port on the transmission line to connect with an antenna radiating element. The radiating element has an elongated form which extends a first predetermined length transverse to an axis of the transmission line. The method also includes dissolving at least one layer of the sacrificial material to form a clearance space between the surface of the dielectric substrate and the antenna radiating element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.