Microstructure manufacturing method and microstructure
US8908274B2 · kind B2 · utility
4Cited by
1References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 8, 2011 |
| Grant date | Dec 9, 2014 |
| Priority date | — |
| Expiry date | Nov 11, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12396
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A microstructure manufacturing method includes: preparing a mold having on a front side thereof a plurality of fine structures, with conductivity being imparted to a bottom portion between the plurality of fine structures; forming a first plating layer between the plurality of fine structures by plating the bottom portion; and forming a second plating layer of larger stress than the first plating layer on the first plating layer between the plurality of fine structures, wherein the stress of the second plating layer is used to curve a back side surface of the mold.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.