Printed circuit board assembly chip package component and soldering component
US8908386B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 1, 2012 |
| Grant date | Dec 9, 2014 |
| Priority date | — |
| Expiry date | May 10, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed circuit board assembly (PCBA) chip package component includes: a module board and an interface board. A first soldering pad is set on the bottom of the module board, a second soldering pad is set on top of the interface board, and the second soldering pad is of a castle-type structure. The first soldering pad includes a first soldering area, a second soldering area, and a connection bridge that connects the first soldering area and the second soldering area. The first soldering area corresponds to a top surface of the second soldering pad, and when the first soldering area is soldered to second soldering pad, the second soldering area is located outside the second soldering pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.