Aqueous floor polishing composition
US8911541B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 22, 2011 |
| Grant date | Dec 16, 2014 |
| Priority date | — |
| Expiry date | Nov 22, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31504
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The present invention is the aqueous floor polishing composition which contains the polyoxyalkylene diester compound represented by the following general formula (1) and does not contain the phosphorus-containing plasticizer. R1 and R2 represent each independently alkyl groups having 1 to 24 carbon atoms, m represents an integer from 2 to 4, n represents a number from 2 to 40.The aqueous floor polishing composition of the present invention does not contain the phosphorus-containing plasticizer. Therefore, it does not affect the environment negatively, in spite of having excellent leveling properties, lustering properties and heel mark resistance properties.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.