Flexible circuit formation
US8911608B1 · kind B1 · utility
3Cited by
49References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 13, 2010 |
| Grant date | Dec 16, 2014 |
| Priority date | — |
| Expiry date | Sep 7, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2857
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention provides a circuit creation technology that improves conductive line manufacture by adding active and elemental palladium onto the surface of a substrate. The palladium is disposed in minute amounts on the surface and does not form a conductive layer by itself, but facilitates subsequent deposition of a metal onto the surface, according to the pattern of the palladium, to form the conductive lines.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.