Heat conduction composition

US8911642B2 · kind B2 · utility

Assignee

• tesa SE · DE

Inventors

• Klaus Keite-Telgenbüscher · Hamburg, DE
• Anja Staiger · Hamburg, DE
• Florian Meyer · Haimhausen, DE

Key dates

• Filing date: Sep 23, 2009
• Grant date: Dec 16, 2014
• Expiry date: Mar 6, 2030

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T428/26
• WIPO field: Macromolecular chemistry, polymers
• WIPO sector: Chemistry

Abstract

A heat conduction composition is proposed, comprising at least one polymer and a heat-conducting auxiliary material that has an especially high heat conductivity and at the same time has a high mechanical strength. To this end, the heat-conducting auxiliary material comprises particles that in turn are made up of primary particles and that have a mass-specific surface area of 1.3 m2/g or less. Also described are a heat-conducting surface element manufactured from said heat conduction composition as well as application possibilities thereof.